MSP430

Auto makers are adding functions that all depend on connectivity. A plenty of companies also offer car-to-cloud platforms. Bear in mind, though, anyone who claims to have an “end-to-end” solution doesn’t. The post Car to Cloud: From Apps to Whole-Car Updates appeared first on EETimes.

The investments includes $400m strategic investments in the Agrate fab; and GaN and 200mm SiC wafer capacity The post ST Plans $1.5B Capex to Achieve $12B Mid-Term Target appeared first on EETimes.

Consumer electronics OEMs can now use NXP's i.MX 8M family of chipsets equipped with Dirac's digital audio platform. The post NXP Turns Up Audio Quality in Smart Speakers, Soundbars appeared first on EETimes.