Component-News

Lattice starts shipping ECP4 FPGAs First Samples

LatticeECP4 Block Diagram

LatticeECP4 Block Diagram

Lattice has begun shipping the highest density member of the next generation LatticeECP4 FPGA family to select customers.

This new family offers the richest portfolio of low cost, low power mid-range devices under 200K LUTs, with high performance innovations such as 6G SERDES in low cost packages, powerful DSP blocks and built-in hard IP-based communication blocks.

The highest density device in the family, the LatticeECP4-190, features 183K LUTs, 480 double data rate DSP multipliers (18×18), 5.8 Mbits of memory and twelve 6 Gbps SERDES channels, making it ideally suited for a broad range of cost- and power-sensitive wireless, wireline, video and computing applications.

 

LatticeECP4 Family:

http://www.latticesemi.com/products/fpga/ecp4/index.cfm

LatticeECP4 Samples:

http://www.latticesemi.com/corporate/newscenter/newsletters/newsjune2012/ecp4samples.cfm

LatticeECP4 Overview Video:

http://www.latticesemi.com/products/fpga/ecp4/overviewvideo.cfm

LatticeECP4 Datasheet:

http://www.latticesemi.com/dynamic/view_document.cfm?document_id=43587

TLV1117: Low cost LDO’s just got lower

TI news:

The TLV1117 is a positive low-dropout voltage regulator designed to provide up to 800 mA of output current.

The device is available in 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V, and adjustable-output voltage options.

All internal circuitry is designed to operate down to 1-V input-to-output differential. Dropout voltage is specified at a maximum of 1.3 V at 800 mA, decreasing at lower load currents.

http://www.ti.com/product/tlv1117?sp_rid_pod4=OTQ4MTM1NzE3OAS2&sp_mid_pod4=39219235

RSS EETimes Semiconductor News
  • Nvidia Mum on 7-nm GPU March 19, 2019
    Nvidia CEO Jensen Huang was silent on his high-end roadmap at a time when the company has a commanding lead in graphics computing and AI.
  • Intel, Cray Win U.S. Exascale Deal March 18, 2019
    The first of three U.S. systems, worth a total of $1.8 billion and capable of exaflop performance, will be built at Argonne National Lab by Intel and Cray.
  • U.S. Court Finds Apple Infringed Qualcomm IP March 18, 2019
    A U.S. federal court found that several iPhone models infringe on patents held by Qualcomm, a major setback for Apple in the patent fight between the two companies that has been unfolding in several jurisdictions throughout the world.