Power
Fairchild’s article about eliminating LED flickering
An interesting article about grid LED Lighting Systems:
http://blog.fairchildsemi.com/2013/eliminate-led-flickering-caused-fluctuating-ac-input
The output response of a PFC controller with and without the additional OVE circuitry
MAX15062: PFM from 60v 3v3 or 5V @300mA
MAX15062 : 60V, 300mA, Ultra-Small, High-Efficiency, Synchronous Step-Down, PFM, DC-DC Converter
Product folder: http://www.maximintegrated.com/datasheet/index.mvp/id/7171
EvKits:
3.3 volt MAX15062AEVKIT http://www.maximintegrated.com/datasheet/index.mvp/id/8178
5 volt MAX15062BEVKIT http://www.maximintegrated.com/datasheet/index.mvp/id/8179
Needless to say: Electricity over IP – the solution
This morning I found A GREAT RFC, the 3251.
RFC 3251 - Electricity over IP
http://www.ietf.org/rfc/rfc3251.txt
http://www.faqs.org/rfcs/rfc3251.html
I think this may be the solution. Unfortunately, it was one of the best kept secrets. Let's make it public available! Is about 11 years old and only pour connaisseurs.
Micro Hydro Power
LV 1500 is a very small and efficient hydro power generator (max. power 1500W) made by Hydro Induction Power, a company based in Redway, CA http://www.homehydro.com/.
The LV1500 re are 12V / 24V / 48V models build around a stainless steel Turgo runner, a brushless alternator and a rectifier.
Impressive is the that it works with 60 to 600 feet Head range and 5 to 100gpm Flow range.
For a greater energy need ( max. 4KW) they offer also another product range here: http://hipowerhydro.com/
- Patent Proposal Could Help EEs June 18, 2019The U.S. Congress is considering legislation on what is eligible for a patent, a bill likely to encourage or at least maintain the level of patent filings by system and chip designers.
- TSMC, Purdue Team Up to Enhance Chip Security June 18, 2019TSMC and Purdue University announced the establishment of a center at the university to enhance semiconductor security.
- Chiplet Ecosystem Slowly Picks up Steam June 18, 2019Momentum is gathering for the heterogeneous integration of chiplets from multiple vendors in a system-in-package.
