Spansion = Cypress
From the Cypress Press Release:
Cypress and Spansion Complete $5 Billion All-Stock Merger
Traveo (Cortex R), FR81S, FR60, FM0+, FM3, FM4, PM ICs, Hyperflash, NOR Memory, NAND, Flash… combined with the Cypress Product Line will create a powerful leader on the market.
- Patent Proposal Could Help EEs June 18, 2019The U.S. Congress is considering legislation on what is eligible for a patent, a bill likely to encourage or at least maintain the level of patent filings by system and chip designers.
- TSMC, Purdue Team Up to Enhance Chip Security June 18, 2019TSMC and Purdue University announced the establishment of a center at the university to enhance semiconductor security.
- Chiplet Ecosystem Slowly Picks up Steam June 18, 2019Momentum is gathering for the heterogeneous integration of chiplets from multiple vendors in a system-in-package.